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Automatic Lead-Free Reflow Soldering Machine

Automatic Lead-Free Reflow Soldering Machine

Update Terakhir 18 / 12 / 2022
Minimal Pembelian 1 Unit

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Detail Automatic Lead-Free Reflow Soldering Machine

Testing Instrument

Temperature area number: up 3/down 0;
Completing precision welding of QFP, CSP, Chip and BGA such devices;
Heating area length: about 1000mm;
Control mode: PID intelligent control;
Heating mode: full infrared heating;
PCB width: net belt type 280 mm;
Transport direction: L-R (left-right);
Power supply : AC 3phase 380V 50Hz;
Start power: 5KW;
Normal work power consumption: Approx.2KW;
Warming time: 15min;
Temperature control scope: room temperature-300 °C;
Control mode: PID + SSR driver;
Temperature control precision: ±1°C;
PCB temperature distribution deviation: ±2°C;
Weight: about 50kg;
Overall dimension: L1500mm×W612mm×H650mm.